PICK & PLACE HANDLER

Xceltron Technologies Pte Ltd (Ubi Cres)
  3. PICK & PLACE HANDLER

PICK & PLACE HANDLER

  • Device types:
    QFP, TSOP,SOP,PGA, BGA,PLCC, LGA 3mm X 3mm ~ 40mm X 40mm (Lead pitch : 0.4mm or more)
  • Test Mode:
    Dual (Pitch between sockets : 80mm) Single
  • Index Time:
    0.5sec. (Same for ambient and high temperature, direct contact) Index time varies depending on the kind of device and socket.
  • Throughput:
    Max.4000 pcs/hr (Ambient, dual test mode) Throughput varies depending on the kind of device and socket.
  • Binning:
    Max. 6 bins(in the case of JEDEC tray)
  • Temperature:
    Ambient Temperature +50ºC ~ +90ºC (±2ºC) +90ºC ~ +130ºC (±3ºC)
  • Tester Interface:
    GPIB, DIO
  • Dimensions:
    170 x 140 x 175 cm (Excludes signal tower)
  • Weight:
    Approx. 900kg
  • Power Requirements:
    AC 200-240V 6KVA
  • Compressed Air:
    0.49MPa or more (dry and clean air)

Description

Features :
Minimized Vibration
• Well matched mechanism and software helps to reduce the vibration of the machine
• Increases the lifespan of the socket and adaptor
Flexible Test Mode
• Soft contact design allows the IC to have minimal pressure with the socket during
placement, after which the force will be adjusted to the preset pressure.
• Inaccuracy of ±0.3mm in the test socket can compensated by the specially designed
mechanism.