XCV 2000
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Ball count:This will include the detection of missing, oversized, undersized, extra and bridging balls.
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Ball Quality:This feature will detect balls which are incomplete, deformed or defective.
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Ball Offset:This feature will measure the pitch of each ball relative to its theoretical value. Package with ball offsets can be quickly detected.
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Package size:The dimension of the singulated BGA unit will be measured automatically.
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Ball to Edge dimension:The distance and alignment between the centre of the balls with respect to the edge of the BGA Package will be measured.
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Geometrical Tolerances:The squareness of the package outline. The skewness of the ball matrix relative to the package outline.
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BGA type:PBGA, FBGA, BGA, CSP packages and wafer bumps
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FOV:max 50mm x 50mm
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Resolution:50um/pixel
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Accuracy:25um
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Speed:70ms/BGA
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Dimension:1650mm(W) X 1500mm(D) X 1400mm(H)
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Power:110V/220V AC
Description
The On-the-fly BGA Inspection System caters for high volume, high speed and non-stop production. This feature ensures that each BGA unit can be measured within a fraction of a second without affecting the performance of other production processes. To be precise –70ms for a 14 X 22 mm BGA package with 153 balls using a Pentium P4. To satisfy the quick setup time requirements in the packaging industry, the time taken to teach or calibrate the Onthe-fly BGA Inspection System is less than 1 minute. This is 15 times faster than most BGA Inspection Systems. Thickness variation in the overmold and substrate distort the true dimensions of the package. To increase repeatability and accuracy, the BGA Inspection System is incorporated with a special designed lens to cater for thickness related variation. Total package thickness variability within 0.5mm can be compensated automatically without costly setup time penalty whenever such variation occurs.